Wafer Backside Grinding Okamoto Machine Tool
Grinding machine, Semiconductor equipment, Gear and Casting only One for Total Abrasive Machine manufacturer in the World ... MAX 450mm wafer chuck table is available for small size wafer batch process3inch wafer 20 batch. Specification. SVG standard specification. ... 2993 Gobara,Annaka,Gunma, JAPAN. TEL FAX027 ...